Weight and cost reduction were the major drivers behind the development of Array’s Patented Grounding Blocks. Molded in space age polymers, the integrated design feature of the Array buses reduces component count to 6 from 64 yielding a significant reduction in failure mode potential over prior devices while simultaneously reducing weight by over 50 percent. Designed for connecting wire shields to ground to protect sensitive digital circuits from RFI, the Array bus utilizes standard crimp contacts individually replaceable if damaged during service or inspection. The result is a neat, efficient, serviceable, low cost method of terminating shields with a voltage drop of less than 25 millivolts.